An FEM study of die attach packaging effect on nanomechanical Si optical filters | AVESİS

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An FEM study of die attach packaging effect on nanomechanical Si optical filters

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Seok S., HAH D.

19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017, Bordeaux, France, 29 May - 01 June 2017

Publication Type: Conference Paper / Full Text
Doi Number: 10.1109/dtip.2017.7984475
City: Bordeaux
Country: France
Abdullah Gül University Affiliated: Yes