An FEM study of die attach packaging effect on nanomechanical Si optical filters

Seok S., HAH D.

19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017, Bordeaux, France, 29 May - 01 June 2017 identifier identifier

  • Publication Type: Conference Paper / Full Text
  • Doi Number: 10.1109/dtip.2017.7984475
  • City: Bordeaux
  • Country: France
  • Abdullah Gül University Affiliated: Yes