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An FEM study of die attach packaging effect on nanomechanical Si optical filters
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S. Seok And D. HAH, "An FEM study of die attach packaging effect on nanomechanical Si optical filters," 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 , Bordeaux, France, 2017

Seok, S. And HAH, D. 2017. An FEM study of die attach packaging effect on nanomechanical Si optical filters. 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 , (Bordeaux, France).

Seok, S., & HAH, D., (2017). An FEM study of die attach packaging effect on nanomechanical Si optical filters . 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017, Bordeaux, France

Seok, Seonho, And DOOYOUNG HAH. "An FEM study of die attach packaging effect on nanomechanical Si optical filters," 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017, Bordeaux, France, 2017

Seok, Seonho And HAH, DOOYOUNG. "An FEM study of die attach packaging effect on nanomechanical Si optical filters." 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 , Bordeaux, France, 2017

Seok, S. And HAH, D. (2017) . "An FEM study of die attach packaging effect on nanomechanical Si optical filters." 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 , Bordeaux, France.

@conferencepaper{conferencepaper, author={Seonho Seok And author={DOOYOUNG HAH}, title={An FEM study of die attach packaging effect on nanomechanical Si optical filters}, congress name={19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017}, city={Bordeaux}, country={France}, year={2017}}