Effects of Growth Rate on Eutectic Spacing, Microhardness, and Ultimate Tensile Strength in the Al–Cu–Ti Eutectic Alloy


Bayram Ü. , MARAŞLI N.

Physics of Metals and Metallography, vol.121, no.4, pp.382-390, 2020 (Journal Indexed in SCI Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 121 Issue: 4
  • Publication Date: 2020
  • Doi Number: 10.1134/s0031918x2004016x
  • Title of Journal : Physics of Metals and Metallography
  • Page Numbers: pp.382-390
  • Keywords: directional solidification, aluminum alloys, microstructure, microhardness, tensile strength, MECHANICAL-PROPERTIES, UNIDIRECTIONAL SOLIDIFICATION, ELECTRICAL CHARACTERIZATION, DIRECTIONAL SOLIDIFICATION, RAPID SOLIDIFICATION, MICROSTRUCTURE, SELECTION, RESISTIVITY, PARAMETERS, LAMELLAR

Abstract

© 2020, Pleiades Publishing, Ltd.Abstract: In the present work, dependences of lamellar spacing (λ), microhardness (HV), and ultimate tensile strength (σUTS) on growth rate (V) were investigated in the Al–Cu–Ti (Al–33 wt % Cu–0.1 wt % Ti) eutectic alloy. For these purposes, the Al–Cu–Ti eutectic alloy was solidified at a constant temperature gradient of 6.45 K mm–1 with a wide range of growth rates, from 8.58 to 2038.65 µm/s. Then, the values of λ, HV, and σUTS were measured on the directionally solidified Al–Cu–Ti specimens. The dependences of λ, HV, and σUTS on V in the Al–Cu–Ti eutectic alloy were experimentally obtained using regression analysis. The results obtained in the present work were compared with the similar experimental results in the literature.