Effects of Growth Rate on Eutectic Spacing, Microhardness, and Ultimate Tensile Strength in the Al–Cu–Ti Eutectic Alloy

Bayram Ü., MARAŞLI N.

Physics of Metals and Metallography, cilt.121, sa.4, ss.382-390, 2020 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 121 Sayı: 4
  • Basım Tarihi: 2020
  • Doi Numarası: 10.1134/s0031918x2004016x
  • Dergi Adı: Physics of Metals and Metallography
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Aerospace Database, Compendex, INSPEC, Metadex
  • Sayfa Sayıları: ss.382-390
  • Anahtar Kelimeler: directional solidification, aluminum alloys, microstructure, microhardness, tensile strength, MECHANICAL-PROPERTIES, UNIDIRECTIONAL SOLIDIFICATION, ELECTRICAL CHARACTERIZATION, DIRECTIONAL SOLIDIFICATION, RAPID SOLIDIFICATION, MICROSTRUCTURE, SELECTION, RESISTIVITY, PARAMETERS, LAMELLAR
  • Abdullah Gül Üniversitesi Adresli: Hayır

Özet

© 2020, Pleiades Publishing, Ltd.Abstract: In the present work, dependences of lamellar spacing (λ), microhardness (HV), and ultimate tensile strength (σUTS) on growth rate (V) were investigated in the Al–Cu–Ti (Al–33 wt % Cu–0.1 wt % Ti) eutectic alloy. For these purposes, the Al–Cu–Ti eutectic alloy was solidified at a constant temperature gradient of 6.45 K mm–1 with a wide range of growth rates, from 8.58 to 2038.65 µm/s. Then, the values of λ, HV, and σUTS were measured on the directionally solidified Al–Cu–Ti specimens. The dependences of λ, HV, and σUTS on V in the Al–Cu–Ti eutectic alloy were experimentally obtained using regression analysis. The results obtained in the present work were compared with the similar experimental results in the literature.