Investigation of the thermoelectrical properties of the Sn91.2−x–Zn8.8–Agx alloys


Sahin M., Cadirli E., Bayram Ü. , Esener P. A.

Journal of Thermal Analysis and Calorimetry, vol.132, no.1, pp.317-325, 2018 (Journal Indexed in SCI Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 132 Issue: 1
  • Publication Date: 2018
  • Doi Number: 10.1007/s10973-017-6939-3
  • Title of Journal : Journal of Thermal Analysis and Calorimetry
  • Page Numbers: pp.317-325
  • Keywords: Directional solidification, Electrical resistivity, Thermal conductivity, Enthalpy, Specific heat, LEAD-FREE SOLDER, CRUCIBLE DIRECTIONAL SOLIDIFICATION, MECHANICAL-PROPERTIES, MICROSTRUCTURE EVOLUTION, THERMAL-BEHAVIOR, AG, CU, RELIABILITY, ALUMINUM, JOINTS

Abstract

© 2017, Akadémiai Kiadó, Budapest, Hungary.Sn91.2−x–Zn8.8–Agx alloys (x = 0.15–10.0 wt%) were directionally solidified upwards at a constant G (4.16 K mm−1) and V (41.5 μm s−1) in a Bridgman-type directional solidification furnace. The electrical resistivity (ρ) measurements of the alloys depending on the temperature were performed using the standard four-point probe method, and the temperature coefficients of the resistivities (α) were calculated. Composition analyses of the alloys were carried out using energy-dispersive X-ray spectroscopy. The enthalpy (∆H) and the specific heat (∆Cp) values of the alloys were determined by differential scanning calorimetry analysis. The thermal conductivity (K) values were obtained from the Wiedemann–Franz equation. According to the experimental results, electrical resistivities increased up to 3.0 mass% Ag and decreased with further increase in Ag content. Enthalpy and specific heat values decreased with the increasing content of Ag. The results were compared with the previous works for Sn–Zn–Ag alloys.