Effect of Sn contents on thermodynamic, microstructure and mechanical properties in the Zn-90-Bi-10 and Bi-88-Zn-12 based ternary alloys

Esener P. A. , ALTINTAS Y. , Bayram Ü., ÖZTÜRK E., MARAŞLI N., Aksöz S.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, cilt.30, sa.4, ss.3678-3691, 2019 (SCI İndekslerine Giren Dergi) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 30 Konu: 4
  • Basım Tarihi: 2019
  • Doi Numarası: 10.1007/s10854-018-00648-4
  • Dergi Adı: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
  • Sayfa Sayıları: ss.3678-3691

Özet

The thermal conductivity variations with temperature for Zn90-x-Sn-x-Bi10 (x=5,10, 40 and 85wt%) and Bi88-x-Sn-x-Zn-12 (x=1.39, 43.26 and 79.3wt%) alloys were measured by using the linear heat flow method. From thermal conductivity-temperature plots, the coefficients of thermal conductivity for the Zn-Sn-Bi alloys were calculated. The microstructures of Zn-Sn-Bi alloys were observed using scanning electron microscopy (SEM). The existing phases into microstructure were identified energy dispersive X-ray (EDX) analysis. The melting temperatures, the enthalpy of fusion and specific heat change between the liquid and solid phases in the Zn-Sn-Bi alloys were determined from Differential Scanning Calorimetry (DSC) trace. The tensile strength and microhardness of the alloys were measured using a Shimadzu Universal Testing Instrument (Type AG-10 KNG) and Future-Tech FM-700 model microhardness device.