Thermal conductivity and electrical resistivity dependences on growth rate in the directionally solidified Al–Cu–Ni eutectic alloy


Bayram Ü. , MARAŞLI N.

Journal of Alloys and Compounds, vol.753, pp.695-702, 2018 (Journal Indexed in SCI Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 753
  • Publication Date: 2018
  • Doi Number: 10.1016/j.jallcom.2018.04.277
  • Title of Journal : Journal of Alloys and Compounds
  • Page Numbers: pp.695-702
  • Keywords: Directional solidification, Aluminum alloys, Microstructure, Thermal conductivity, Electrical resistivity, TEMPERATURE-GRADIENTS, PHYSICAL-PROPERTIES, LAMELLAR SPACINGS, TENSILE-STRENGTH, SN, MICROSTRUCTURE, ZN, MICROHARDNESS, SYSTEMS, SELECTION

Abstract

© 2018 Elsevier B.V.The thermal conductivity and electrical resistivity dependences on growth rate in the directionally solidified Al-Cu-.Ni eutectic alloy (Al-32.5 wt%Cu-%1 wt.Ni) were investigated. For this purpose, the Al-Cu-.Ni eutectic alloy was solidified at a constant temperature gradient of 4.93 K mm−1 with different growth rates, V = 9.25–2056.68 μm s−1 by a Bridgman type directional solidification furnace. The thermal conductivity (K) and electrical resistivity (ρ) of the Al-Cu-Ni alloy solidified with different growth rates were measured with the longitudinal heat flow method and DC four−point probe technique at room temperature. The dependences of K and ρ on V for directionally solidified Al-Cu-Ni eutectic alloy were experimentally obtained by linear regression analysis. Finally, the specific heat difference between solid and liquid phases (ΔCP) and enthalpy of fusion (ΔH) for Al-32.5 wt%Cu-%1 wt.Ni alloy were determined by means of differential scanning calorimetry (DSC) at its melting temperature.