Loading-rate effect on tensile and bending strength of 3D-printed polylactic acid adhesively bonded joints


ATAHAN M. G. , APALAK M. K.

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2021 (SCI İndekslerine Giren Dergi) identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası:
  • Basım Tarihi: 2021
  • Doi Numarası: 10.1080/01694243.2021.1922022
  • Dergi Adı: JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY

Özet

Additive manufacturing provides the production of many machine parts and components with complex geometries. The adhesive bonding technique can be alternative method for joining parts produced with additive manufacturing. This experimental study investigates the applicability of the adhesive bonding technique for PLA (polylactic acid) adherends produced with additive manufacturing and especially the effects of loading rate on the strength of 3D-printed PLA adhesive single-lap joints under tensile, three-point bending (with shear) and four-point bending (no shear effect) loadings. Both PLA and adhesive tensile test specimens exhibited a better strength but lower failure strain with increasing loading rate. PLA had better mechanical behaviour in the raster orientation than those in the layer-build direction. The strength of adhesive single-lap joints improved slightly with increasing loading rate for the tensile and three-point bending tests whilst a decrease of strength and an improvement of bending stiffness were observed for the four-point bending test. Failure initiated at the free edge of the top adherend-adhesive interface for all tests, and propagated along this interface for both bending tests whilst a sudden through-the-thickness failure of top adherend occurred for tensile load after a small interfacial damage propagation. The failure propagation appeared in a wavy form for the three-point bending test whilst it was along the top adherend-adhesive interface for the four-point bending test. Digital Image Correlation (DIC) method for tensile tests showed that the peeling and shear strains were more critical and concentrated around both free edges of adherend-adhesive interfaces; thus, at the right free edge of the top adherend-adhesive interface and at the left free edge of the bottom adherend-adhesive interface.