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10th International Conference on Materials Science and Nanotechnology For Next Generation (MSNG-2023), Kayseri, Turkey, 27 - 29 September 2023, pp.81
Some results of the study of directionally solidified Sn–Zn–Al eutectic alloy, which may be a possible lead-free solder candidate, especially for high-temperature applications, are given in this research paper. The composition of the Sn-Zn-Al eutectic alloy was determined from the phase diagram in the literature as Sn–10.37 wt.% Zn–1.87 wt.% Al and the alloy was prepared in a vacuum melting furnace. Afterward, the eutectic alloy was directionally solidified upward at a constant temperature gradient (G = 4.76 K mm–1) and constant growth rate (V) (8.12 μm s–1) by using a Bridgman-type directional solidification apparatus (BTDSA). After the experimental stages, the average values of electrical resistivity (ρ), ultimate tensile strength (σUTS), microhardness (HV) and eutectic spacing (λ) were measured from transverse section of the directionally solidified sample. Since the phases forming the alloy can be observed easily, the microstructure of the sample was photographed with an Olympus BHX-type light optical microscope (Integrated Olympus DP12 digital camera), and also X-ray diffraction (XRD – Bruker, Discover 8, Germany) was used for the characterization of the alloy and the detection of the phases. The resulting experimental data were compared with the Sn–Zn based binary and ternary alloy system data in the literature.