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Design of capacitive micromachined ultrasonic transducers (CMUTs) on a flexible substrate for intravascular ultrasonography (IVUS) applications
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D. HAH Et Al. , "Design of capacitive micromachined ultrasonic transducers (CMUTs) on a flexible substrate for intravascular ultrasonography (IVUS) applications," 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 , Bordeaux, France, 2017

HAH, D. Et Al. 2017. Design of capacitive micromachined ultrasonic transducers (CMUTs) on a flexible substrate for intravascular ultrasonography (IVUS) applications. 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 , (Bordeaux, France).

HAH, D., Je, C. H., & Lee, S., (2017). Design of capacitive micromachined ultrasonic transducers (CMUTs) on a flexible substrate for intravascular ultrasonography (IVUS) applications . 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017, Bordeaux, France

HAH, DOOYOUNG, Chang Han Je, And Sung-Q Lee. "Design of capacitive micromachined ultrasonic transducers (CMUTs) on a flexible substrate for intravascular ultrasonography (IVUS) applications," 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017, Bordeaux, France, 2017

HAH, DOOYOUNG Et Al. "Design of capacitive micromachined ultrasonic transducers (CMUTs) on a flexible substrate for intravascular ultrasonography (IVUS) applications." 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 , Bordeaux, France, 2017

HAH, D. Je, C. H. And Lee, S. (2017) . "Design of capacitive micromachined ultrasonic transducers (CMUTs) on a flexible substrate for intravascular ultrasonography (IVUS) applications." 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 , Bordeaux, France.

@conferencepaper{conferencepaper, author={DOOYOUNG HAH Et Al. }, title={Design of capacitive micromachined ultrasonic transducers (CMUTs) on a flexible substrate for intravascular ultrasonography (IVUS) applications}, congress name={19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017}, city={Bordeaux}, country={France}, year={2017}}